Thermal bonding test device WNH-I
The thermal bonding test device is designed according to the standard GB/T4074.3-2008, which detect the ability of the coils to be glued together under the action of heat and solvent. It is suitable for enameled round wires with nominal diameter above 0.05mm or less than 2.00mm.
1) Diameter error of round rod: d +0.040 ， -0.098；
2) Compression weight error: ±5%；
3) Separation weight error: ±5%.
